As I have been moving forward on the PCB layout, changes are getting smaller and I need to be more precise in making them. This slows down progress, as I really want to work on the PCB, only when my personal energy and patience are at high levels.<\/p>\n
Had good energy early this morning and made progress on some touchy areas in and around the power supply. I finally feel that the back copper layer is starting to look close to where I want it. Changes to the back copper from here on out, are going to be very minor. In fact, on the back copper, I’m thinking of taking a shot at rounding off corners on the small traces, which is one of the last tasks for this layer.<\/p>\n
On the front copper, before declaring victory, I want to do some trace spacing tweaks, especially in the busy areas between chip rows A & B and also B & C.<\/p>\n
Front silk screen is pretty good, but I will improve character to character spacing in a couple of text strings and also improve the shape of the decoupling capacitor symbol.<\/p>\n
My first pass through a PCB vendors DFM check returned a number of issues, I’m working through.<\/p>\n
Besides circuit design reviews, I need to do a review of hole sizes – nothing worse than a hole too small to fit the designated component.<\/p>\n
Regards,
\nMike Willegal<\/p>\n","protected":false},"excerpt":{"rendered":"
As I have been moving forward on the PCB layout, changes are getting smaller and I need to be more precise in making them. This slows down progress, as I really want to work on the PCB, only when my … Continue reading